概述

Fabricating semiconductor devices involves four broad processes: deposition, removal, patterning, and modification of electrical properties. The semiconductor industry continually faces new challenges as products become smaller, more powerful and highly mobile. Ultra-thin layers, smaller critical dimensions, new materials, 3D structures, and the ongoing need for higher yield and productivity drive the need for tighter process measurement and control. QiiMii is there to help you succeed at every step.

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